PACK EXPO International brings together packaging and processing professionals from around the world, showcasing the latest technologies, innovations and solutions shaping the future of manufacturing.

PERFINOX will be present at the Krones booth, showcasing advanced process engineering solutions for the food industry, with a strong focus on high-viscosity and complex food applications.

Join us to discover how we support our partners in developing, testing and scaling their processes, from concept to industrial reality.

Dates
October 18 – 21, 2026

Location

McCormick Place
2301 S. King Drive
Chicago, IL 60616, USA

Krones Booth
South Building – S-2536